Veja como a simulação multifísica é usada em pesquisa e desenvolvimento
Aqui você encontrará apresentações realizadas nas Conferências de Usuários COMSOL de todo o mundo. As apresentações englobam pesquisas e produtos inovadores feitas por engenheiros e cientistas usando o COMSOL Multiphysics. Os tópicos abrangem uma grande gama de indústrias e aplicações, como elétrica, mecânica, escoamento e química. Use a função de busca "Quick Search" para encontrar apresentações na sua área de interesse.
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Heat and Mass Transfer Modelling in Lyophilization Using COMSOL Multiphysics® new
Lyophilization is a dehydration process used to preserve perishable material like food. It depends on many parameters like temperature, pressure, rate of drying, type of heating for sublimation, chamber size etc. Therefore, optimization of multiple parameters is required for design and ... Saiba Mais
Numerical Simulation of Melt Hydrodynamics in Laser Micro Processing using COMSOL Multiphysics® new
Laser material processing at micro-meter domain can be used for a plethora of applications such as micro drilling, micro welding, micro cutting, micro-texturing as well as micro polishing. These processes are governed by the time varying, complex melt hydrodynamics courtesy of melting ... Saiba Mais
Stiffness Analysis of Stabilizer Bar new
Anti-roll bar or stabilizer bar is a critical component for vehicle’s roll stiffness. This plays a major role in cornering and overall vehicle dynamics. Various methods can be used to calculate stiffness of roll bar at design stage. A simple formula-based method is used calculate the ... Saiba Mais
Design and Simulation of a Dual Axis Thermal Accelerometer using Single Axis Structure new
An accelerometer detects acceleration and tilt of a device. There are several areas where accelerometers are in use, e.g. aerospace, navigation, automotive industry, electronic gadgets etc. According to different working principle, there are different types of accelerometer, e.g. piezo ... Saiba Mais
Simulation of Drying Process During Fabrication of Lithium-Ion Battery Porous Electrode new
Lithium ion battery electrodes are porous composite film made up of two or three different types of solid material. Typically using the fabrication of the electrode, the solid powders (active material, binder and in most cases a conductive active) are dispersed in a solvent like NMP and ... Saiba Mais
FEM Simulation of Interdigitated Electrodes (IDEs) Device new
In this, FEM simulation of the interdigitated electrodes (IDEs) device using COMSOL Multiphysics® is presented. In this study, the effect of meshing sequence on the performance of IDEs device was evaluated using normal as well as adaptive mesh refinement. The key parameters such as of ... Saiba Mais
Comparative Numerical Simulation of Masonry arch with Different Interlocking Pattern new
Arches being one of the most aesthetic and stable form of structural elements, have been constantly used since hundreds of years in various form of constructions be it buildings, bridges or any other structural system. Though, common use of reinforced concrete framed structures has ... Saiba Mais
Numerical Study of Millimeter-Scale Magnetorheological Elastomer Robot for Undulatory Swimming new
Numerical investigations of magnetorheological elastomer millimeter-scale robots capable of undulatory swimming under magnetic body torques are realized for the first time in low Reynolds number condition using AC/DC, CFD, Structural Mechanics modules in COMSOL Multiphysics®. The ... Saiba Mais
Analysis of the Material Removal Rate and Smoothing Effect of Active Fluid Jet Polishing new
Active fluid jet polishing is a sub-aperture polishing process used in the optical fabrication of complex surfaces. Correction of surface irregularities during the polishing process is a challenging process. Quality of optical surface depends on smoothing action during fine and ... Saiba Mais
Electronic Thermal Control using Heat Sink for Chip Cooling under Forced Convection new
This paper presents numerical investigation of electronic thermal control using heat sink for integrated circuit (IC) chip cooling under forced convection in a horizontal channel. Steady state, three dimensional, incompressible, laminar forced convection cooling of chip attached with ... Saiba Mais
