Aqui você encontrará apresentações realizadas nas Conferências de Usuários COMSOL de todo o mundo. As apresentações englobam pesquisas e produtos inovadores feitas por engenheiros e cientistas usando o COMSOL Multiphysics. Os tópicos abramgem uma grande gama de indústrias e aplicações, como elétrica, mecânica, escoamento e química. Use a função de busca "Quick Search" para encontrar apresentações na sua área de interesse.

FEM Correlation and Shock Analysis of a VNC MEMS Mirror Segment - new

E. Aguayo[1], R. Lyon[2], M. Helmbrecht[3], S. Khomusi[1]
[1]The Newton Corporation, Bowie, MD, USA
[2]NASA Goddard Space Flight Center, Greenbelt, MD, USA
[3]Iris AO, Inc., Berkeley, CA, USA

Microelectromechanical systems (MEMS) are becoming more prevalent in today’s space technologies. The Visible Nulling Coronagraph (VNC) instrument, being developed at the NASA Goddard Space Flight Center, uses a MEMS Mirror to correct wavefront errors. This MEMS, the Multiple Mirror Array (MMA), will enable the VNC instrument to detect Jupiter and ultimately Earth size exoplanets. The MMA ...

Infrasound Assessment of the Roller Compacted Concrete Dam: Case Study of the Portugues Dam in Ponce, PR

H. Diaz-Alvarez [1], V. P. Chiarito [1], S. McComas [1], M. H. McKenna [1],
[1] U.S. Army Engineer Research and Development Center, Vicksburg, MS, USA

The U.S. Army Corps of Engineers is currently investigating the use of infrasound sensors to monitor the health of structures of interest. Infrasound is low-frequency (2-20 Hz) acoustic energy and is capable of propagating many kilometers from the source structure. Large infrastructure, such as dams, bridges, and buildings emit such signals at their natural or driven frequencies of vibration, ...

Stress Evolution due to EM in Metal Line Confined: Model and Correlation with Experiments

G. Marti [1], L. Arnaud [2], Y. Wouters [3]
[1] STmicrolectronics & Univ. Grenoble Alpes-SIMAP, France
[2] Cea-Leti Minatec, Grenoble, France
[3] Univ. Grenoble Alpes-SIMAP, Grenoble, France

Electromigration induced failure is one of the main reliability issues for the microelectronics industry. The continuous scaling of the interconnect dimensions leads to higher operating current densities and temperatures, which accentuates the electromigration failure. As a consequence, electromigration still poses challenges for the development of the new technological nodes. Electromigration ...

Fatigue Damage Evaluation on Mechanical Components under Multiaxial Loadings

R. Tovo[1] and S. Capetta[1]
[1]Dipartimento di Ingegneria, Università degli Studi di Ferrara, Ferrara, Italy

This paper is concerned with the fatigue behavior of complex, three-dimensional, stress concentrations under multiaxial loadings. Starting from the stress field obtained from a linear elastic analysis and taking advantage of the so-called implicit gradient approximation, an effective stress index connected with the material strength is calculated. Besides, this work summarizes a first ...

Dynamic Model for Catenary Mooring: Experimental Validation of the Wave Induced Load

L. Martinelli[1], A. Spiandorello[2], P. Ruol[3], and A. Lamberti[1]
[1]DICAM, Università di Bologna, Italy
[2]Civil Engineer, Italy
[3]IMAGE, Università di Padova, Italy

This paper will present a numerical model based on COMSOL Multiphysics suited to simulate the dynamic response of a catenary mooring (or a submarine cable). In general, mooring lines are subject to a direct wave load (e.g. drag, inertia) in addition to the movement of the vessel to which they are linked. Tests were carried out at the wave flume of the Maritime Laboratory of IMAGE Department, ...

Numerical Modelling Of Moisture Related Mechanical Stress In Wooden Cylindrical Objects Using COMSOL: A Comparative Benchmark

H. Schellen, and J. Van Schijndel
Eindhoven University of Technology, Eindhoven, The Netherlands

For preservation of artefacts in a museum the indoor climate is often restricted to a very narrow interval for temperature, but most of all for relative humidity. In old buildings the museum conditions of artefacts, e.g. near cold walls, mostly are not in line with museum recommendations.To have an impression of indoor museum climates in old buildings, a large number of case studies were carried ...

Thermal Stress in a Zero Thermal Expansion Composite

C. Romao, and M. White
Dept. of Chemistry and Institute for Research in Materials
Dalhousie University
Halifax, NS
Canada

A series of 2-D finite element models of a ZrO2-ZrW2O8 composite system were created in COMSOL Multiphysics to study the effect of pores between the matrix (ZrO2) and filler (ZrW2O8) materials. Pores were modeled as ellipses concentric with the filler particles. Seventeen model geometries of varying microstructure were studied in order to determine correlations between microstructural ...

Evaluation of Low-Cycle-Fatigue Life of Solder Joints in Surface Mounting Power Devices by Finite Element Modeling

N. Delmonte[1], F. Giuliani[1], M. Bernardoni[2], P. Cova[1]
[1]Dipartimento di Ingegneria dell'Informazione, Università degli Studi di Parma, Parma, Italy
[2]CDTR - Centre for Device Thermography and Reliability, H. H. Wills Dept. of Physics, University of Bristol, Bristol, United Kingdom

The reliability of solder joints [1,2] is one of the key factors in the determination of the reliability of the high power density electronic converters, being the solder joints both the mechanical, the electrical, and often the thermal connections between the electronic component and the board in which the component is placed. The main mechanism by which solder joints are damaged is thermal ...

A Computational Approach for Optimizing the First Flyer Using COMSOL Multiphysics

A.H. Aziz[1], H. Pourzand[1], A.K. Singh[1]
[1]Pennsylvania State University, University Park, PA, USA

COMSOL Multiphysics software was used to structurally optimize the Wright brothers’ flyer. The flyer was drawn in SolidWorks, imported and meshed in COMSOL. COMSOL Solid Mechanics module was used to analyze the flyer. Four of the sixteen struts were removed yet the structural integrity of the flyer was maintained. COMSOL Laminar Flow module was used to compute the aerodynamic forces and ...

A Study of Geometrical Shape of Central Plate in Electrostatic Actuation

K. M. V. Swamy[1], B. G. Sheeparamatti[1], G. R. Prakash [1]
[1]Department of Electronics and Communication, Basaveshwara Engineering College, Bagalkot, Karnataka, India

This study is performed to know which central plate geometry is best suited for electrostatically actuated switch. The simulation is carried out in COMSOL Multiphysics, where user is free to model the geometry without depth knowledge about geometrical dependency of electrostatic. The study of the centrally suspended geometrical models such as circle, square and rectangle suspended by two short ...