Aqui você encontrará apresentações realizadas nas Conferências de Usuários COMSOL de todo o mundo. As apresentações englobam pesquisas e produtos inovadores feitas por engenheiros e cientistas usando o COMSOL Multiphysics. Os tópicos abrangem uma grande gama de indústrias e aplicações, como elétrica, mecânica, escoamento e química. Use a função de busca "Quick Search" para encontrar apresentações na sua área de interesse.

Electric Field Induced Patterning in Thin Films

A. Atta [1], S. Dwivedi [1], Vivek [1], R. Mukherjee [1],
[1] Indian Institute of Technology Kharagpur, Kharagpur, West Bengal, India

Interfacial structures/pattern, especially with small-scale dimensions, are important to the chemistry of materials in determining the optical, electrical, mechanical, or other physical properties of novel materials. Polymers are often used for surface patterning. The diversity, the relatively low cost, the convenient mechanical properties and the compatibility with most patterning techniques ...

Designing Piezoelectric Interdigitated Microactuators using COMSOL

O. Myers [1], M. Anjanappa [2], and C. Freidhoff [3]

[1] Mississippi State University, Mississippi State, MS, USA
[2] University of Maryland Baltimore County, Baltimore, MD, USA
[3] Northrop Grumman Corporation, Electronics Systems Sector, Baltimore, MD, USA

This paper presents a methodology towards designing, analyzing and optimizing piezoelectric interdigitated microactuators using COMSOL Multiphysics. The models used in this study were based on a circularly interdigitated design that takes advantage of primarily the d33 electromechanical piezoelectric constant coefficient. Because of the symmetric nature of the devices, 2D axisymmetric models ...

Simulation of Topology Optimized Electrothermal Microgrippers

O. Sardan[1], D. Petersen[1], O. Sigmund[2], and P. Boggild[1]
[1]DTU Nanotech, Denmark
[2]DTU Mechanical Engineering, Denmark

In this work, electrothermal microgrippers designed using topology optimization are modeled. The microgrippers are composed of two 5 μm-thick polysilicon actuators facing each other. The gap between the actuators are 2 μm in the initial state and the microgrippers are able to both fully close and further open this gap. The operation principle of the actuators is quite similar to that of a ...

Contactless Excitation of MEMS Resonant Sensors by Electromagnetic Driving

M. Baù[1], V. Ferrari[1], and D. Marioli[1]
[1]Department of Electronics for Automation, University of Brescia, Brescia, Italy

A contactless electromagnetic principle for the excitation of mechanical vibrations in resonant structures has been investigated. The principle relies on no specific magnetic property of the resonator except electrical conductivity and can be adopted for employing the structures as resonant sensors for measurements either in environments not compliant with the requirements of active electronics ...

Design and Analysis of Implantable Nanotube Based Sensor for Continuous Blood Pressure Monitoring

M. Silambarasan, T. Prem Kumar, M. Alagappan, and G. Anju
PSG College of Technology
Tamil Nadu, India

The present work aims to develop a blood pressure sensor using MEMS/NEMS technology. A normal blood pressure detector is used externally, but this work mainly aims for designing an implantable nanotube based sensor for continuous monitoring of blood pressure. The use of COMSOL Multiphysics 4.1 acts as a good platform to develop a nano tube based sensor design by using the MEMS module. The ...

3D Stationary and Temporal Electro-Thermal Simulations of Metal Oxide Gas Sensor Based on a High Temperature and Low Power Consumption Micro-Heater Structure

N. Dufour[1], C. Wartelle[2], P. Menini[1]
[1]LAAS-CNRS, Toulouse, France
[2]Renault, Guyancourt, France

The aim of this work was to simulate the electro-thermal behavior of a micro-hotplate used as a gas sensor, in order to compare the obtained results with a real structure. The structure has been designed in 3D and a stationary and a temporal study has been realized.

Thermomechanical Effects of the Packaging Molding Process on the Chip in Integrated Circuits - new

N. Semmar[1], M. Fournier[1], P. S. Alleaume [2], A. Seigneurin [3], , ,
[1]GREMI-UMR7344, CNRS/University of Orléans, Orléans, France
[2]Collegium Sciences et Techniques, Orléans, France
[3]ST Microelectronics Tours SAS, Tours, France

Usually, in integrated circuits, the chip is brazed on leadframe and then, a polymer resin is molded around to create the packaging. On the first hand, the molding process at high temperatures will induce thermomechanical stress on the chip. As the leadframe, the chip and the braze have all different thermoelastic properties, these stress can be critical for the chip connections. To ...

Chemical Reaction Engineering: Difusão com Biotransformação

D. R. M. Vieira [1], S. A. Cardoso [1], A. S. Santos [1],
[1] Universidade Federal do Pará, Pará, Brasil

A biotransformação de substratos utilizando enzimas imobilizadas em nanopartículas presentes num meio fluido (substrato), contido num bioreator CSTR, foi investigada. O software COMSOL Multiphysics foi usado para simular o sistema através do uso das equações de difusão de espécies apropriadas para o consumo do substrato. Nessa investigação, a difusão na superfície da nanopartícula, onde ocorre a ...

Push or Pull, How Does Silk Flow?

J. Sparkes [1],
[1] University of Sheffield, Sheffield, UK

Silk is one of the longest used and most recognizable textiles that we, as a society, use regularly. We see it as a luxury good, worn as an indicator of success and value. However, despite mankind having domesticated and farmed silkworms for millennia, we still know relatively little about the manufacturing process which converts the liquid silk into the fibers we are so familiar with. Increased ...

Design of an Electrodynamically Actuated Microvalve Using COMSOL Multiphysics® and MATLAB®

M. Williams, J. Zito, J. Agashe, A. Sopeju, and D. Arnold
University of Florida, Gainesville, USA

This paper describes the design of a normally closed, electrodynamic microvalve.  Magnetic forces between a permanent magnet in the valve cover and a soft magnet in the valve seat hold the valve closed.  The combination of electrodynamic actuation and a mechanical restoring spring are used to open the valve.  A device model and a design optimization strategy using COMSOL ...