Aqui você encontrará apresentações realizadas nas Conferências de Usuários COMSOL de todo o mundo. As apresentações englobam pesquisas e produtos inovadores feitas por engenheiros e cientistas usando o COMSOL Multiphysics. Os tópicos abramgem uma grande gama de indústrias e aplicações, como elétrica, mecânica, escoamento e química. Use a função de busca "Quick Search" para encontrar apresentações na sua área de interesse.

FEM-Simulation of a Printed Acceleration Sensor with RF Readout Circuit

H. Schweiger[1], T. Göstenkors[1], R. Bau[1], D. Zielke[1]
[1]Dept. Engineering Sciences and Mathematics, University of Applied Sciences Bielefeld, Bielefeld, Germany

In this paper we want to figure out the development of a capacitive acceleration-sensor system with the FEM-Method. The sensor-system is in the position to detect accelerations in the range of ±20 g. Furthermore the sensor-element contains a printed RF-inductance, which is used for contactless data transfer. On the one hand the simulation of the L-C-oscillating circuit using the RF Module of ...

Development and Characterization of High Frequency Bulk Mode Resonators

H. Pakdast, Z. Davis
DTU Nanotech, Technical University of Denmark, Kgs. Lyngby, Denmark

This article describes the development of a bulk mode resonator which can be employed for detection of bio/chemical species in liquids.  The goal is to understand the mechanical and electrical properties of a bulk mode resonator device which exhibit high frequency resonance modes and Q-factor. A high resonance frequency is desirable because a small change in the resonator’s mass, for ...

µHeater on a Buckled Cantilever Plate for Gas Sensor Applications

A. Arpys Arevalo Carreno[1], E. Byas[1], I.G. Foulds[1]
[1]King Abdullah University of Science and Technology, Thuwal, Mecca, Kingdom of Saudi Arabia

In semiconductor gas sensors, the base of the gas detection is the interaction of the gaseous species at the surface of the semiconducting sensitive material. Since the chemical reactions at the surface of the sensor material are functions of temperature. We simulate our µHeater design on a Buckled Cantilever Plate (BCP). Such structure allows the sensor to be suspended for thermal insulation. ...

Heterodimensional Charge-Carrier Confinement in Sub-Monolayer InAs in GaAs - new

S. Harrison[1], M. Young[1], M. Hayne[1], P. D. Hodgson[1], R. J. Young[1], A. Strittmatter[2], A. Lenz[2], U. W. Pohl[2], D. Bimberg[2]
[1]Department of Physics, Lancaster University, Lancaster, UK
[2]Institut für Festkörperphysik, Berlin, Germany

Low-dimensional semiconductor nanostructures, in which charge carriers are confined in a number of spatial dimensions, are the focus of much solid-state physics research, offering superior optical and electronic properties over their bulk counterparts. Both two-dimensional (2D) and zero-dimensional (0D) structures have seen wide-ranging applications in laser diodes, solar cells and LEDs to name ...

The Simulation of Motion of a Slider upon a Stator Due to Frictional Force Using COMSOL Multiphysics® Software - new

H. B. Nemade[1]
[1]Indian Institute of Technology Guwahati, Guwahati, Assam, India

The Surface Acoustic Wave (SAW) linear motor was studied which is developed utilizing the friction principle for driving. The principle says that, when a slider is placed on the Rayleigh waves generated on a stator, the slider moves in reverse direction of the wave due to friction between the stator and the slider. A LiNbO3 piezoelectric substrate is used as a stator where comb structured Al ...

Experimentally Matched Finite Element Modeling of Thermally Actuated SOI MEMS Micro-Grippers Using COMSOL Multiphysics

M. Guvench[1], and J. Crosby[1]
[1]University of Southern Maine, Gorham, Maine, USA

In “Micro-Electro-Mechanical-Systems” shortly known as MEMS, one of the most important and effective principle of creating transduction of electrical power to displacement force is thermal expansion. A slim beam of MEMS material, typically Silicon, is heated by the application of electrical current via Joule heating; it expands and creates motion. In the design of many MEMS devices ...

The Effect of Electrochemical Micro-Milling by Rotating Magnetic Field

H-Y. Shen[1], H-P. Tsui[1], J-C .Hung[1], S-Y. Lin[2], and B-H. Yan[2]
[1]Metal Industries Research and Development Centre, Taichung, Taiwan
[2]National Central University, Chungli, Taiwan

In this work, the process of micro-channels in electrochemical micro-milling by using rotating magnet assisted helical tool is presented. The results show helical tool and Lorentz force of the rotating magnetic field that enhance the renewal of the electrolyte and machining efficiency. The feed rate can be raised under the magnetic field assisted in terms of experimental results; moreover, the ...

Analysis of Electroosmotic Flow of Power-law Fluids in a Microchannel(1D)

K. SriNithin[1]
[1]IIT Kharagpur, Kharagpur, West Bengal, India

Electroosmotic flow of power-law fluids in a slit channel(1D) is analyzed. The governing equations are the Poisson–Boltzmann equation, the Cauchy momentum equation, Generalized Smoluchowski equation and the continuity equation are used to get shear stress, dynamic viscosity, and velocity distribution. Simulations are performed to examine the effects of ?H, flow behavior index, double layer ...

Capacitive Accelerometer Characteristics Study

B. S. Kavitha[1], S. B. Rudraswamy[1], C. R. Venugopal[1]
[1]SJCE, Mysore, Karnataka, India

This paper will describe the dependence of capacitive accelerometer characteristics on the accelerometers physical dimension and its material properties. The sense element of the accelerometer is designed on the basis of a commercially available torsion based accelerometer technology. The sense element consists of an asymmetrically shaped flat plate of metal supported above a substrate surface ...

Multi-Domain Analysis of Silicon Structures for MEMS Based-Sensors

N. Bhalla[1], S. Li[2], and D. Chung[1]
[1]Chung Yuan Christian University, Chungli,Taiwan
[2]National Tsing Hua University, Hsinchu, Taiwan

Investigation in this paper aims at performing Mechanical Stress Strain analysis, Thermal, Piezoresistive and Piezoeletric analysis of Silicon Structures using COMSOL. The simulation results have been cross checked by mathematical calculation.