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Aqui você encontrará apresentações realizadas nas Conferências de Usuários COMSOL de todo o mundo. As apresentações englobam pesquisas e produtos inovadores feitas por engenheiros e cientistas usando o COMSOL Multiphysics. Os tópicos abramgem uma grande gama de indústrias e aplicações, como elétrica, mecânica, escoamento e química. Use a função de busca "Quick Search" para encontrar apresentações na sua área de interesse.

Modelling of the Wool Textile Finishing Processes

M. Giansetti[1], A. Pezzin[1], S. Sicardi[1], G. Rovero[1]
[1]Politecnico di Torino, Torino, Italy

Within wool textile industries, a very important role is played by the so-called finishing processes, in which the textile substrate undergoes steam treatments to achieve the desired level of stabilisation and appearance. Process parameters, namely temperature and moisture content, are known only at the beginning of the process but not in the textile material being treated, where the actual ...

Passive Thermal Control for Window Insulation - new

E. Konroyd-Bolden[1], Dr. Z. Liao[1]
[1]Department of Architectural Science, Ryerson University, Toronto, ON, Canada

A requirement of the building envelope is to act as environmental separator. Energy is one component that we sometimes wish to control. How can this yield passive benefits such as solar heating? This research focuses on control of thermal radiation energy, and the role windows play as transfer medium between indoor and outdoor environments. A novel concept for passively controlling solar ...

Toward Energy Zero Building: A COMSOL Multiphysics® Model of Building and its HVAC System - new

F. Bruno[1]
[1]ENERSPACE Srl, Genoa, Italy

A model built with COMSOL Multiphysics® to exploit meteorological forecasts and instant outdoor meteorological data (temperature, solar radiation, moisture, wind speed and direcition, etc.) together with indoor ambient data (air temperature, radiant temperature of enclosures, etc), building parameters (mass, orientation, surface, structural composition, etc.) and historical consumption of ...

Thermomechanical Effects of the Packaging Molding Process on the Chip in Integrated Circuits - new

N. Semmar[1], M. Fournier[1], P. S. Alleaume [2], A. Seigneurin [3], , ,
[1]GREMI-UMR7344, CNRS/University of Orléans, Orléans, France
[2]Collegium Sciences et Techniques, Orléans, France
[3]ST Microelectronics Tours SAS, Tours, France

Usually, in integrated circuits, the chip is brazed on leadframe and then, a polymer resin is molded around to create the packaging. On the first hand, the molding process at high temperatures will induce thermomechanical stress on the chip. As the leadframe, the chip and the braze have all different thermoelastic properties, these stress can be critical for the chip connections. To ...

Negative Thermal Expansion Materials: Thermal Stress and Implications for Composite Materials

M.J. Jakubinek[1,2], C.A. Whitman[2,3], and M.A. White[1,2,3]
[1]Department of Physics and Atmospheric Science, Dalhousie University, Halifax, Nova Scotia, Canada
[2]Institute for Research in Materials, Dalhousie University, Halifax, Nova Scotia, Canada
[3]Department of Chemistry, Dalhousie University, Halifax, Nova Scotia, Canada

There is considerable interest in the possibility of combining NTE materials with normal (positive) thermal expansion materials, to reduce the potential of failure of a material or component due to thermal stress fracture. Finite element analysis (FEM) is used to explore the overall expansion and thermal stress in composites.

Several Benchmarks for Heat Transfer Problems in COMSOL Multiphysics®

S. Titarenko[1]
[1]University of Leeds, Leeds, United Kingdom

Nowadays all branches in modern science and industry tend to solve ever complicating problems. As the result the computational time increases considerably and it become very important to reduce the processing time and use available resources more efficiently. Parallelizing problem proves itself as efficient way to overcome the described problem. In the poster we compare different methods of ...

Analysis of Heat Transfer in a Complex Three Dimensional Structure Fabricated by Additive Manufacturing - new

C. Settle[1], K. Hoshino[1]
[1]Biomedical Engineering Department, University of Connecticut, Storrs, CT, USA

The goal of this study was to create a three dimensionally designed biomedical device with multiple functionalities and analyze its simulated heat transfer. The device would be fabricated through additive manufacturing; specifically electron beam melting (EBM). EBM has a feature size constraint of 1 mm (acceptable for this design) and is only capable of manufacturing titanium alloys [2]; a ...

Improving Heating Uniformity of Dried Fruit in RF Treatments for Pest Control: Model Development and Validation - new

B. Alfaifi[1], J. Tang[2], Y. Jiao[2], S. Wang[3], B. Rasco[2], S. Jiao[2], S. Sablani[2]
[1]King Saud University, Riyadh, Saudi Arabia
[2]Washington State University, Pullman, WA, USA
[3]Northwest A&F University, Yangling, Shaanxi, China

Non-uniform heating is one of the most important challenges during the development of radio frequency (RF) heat treatments for pest control. A computer simulation model using finite element–based COMSOL Multiphysics® software was developed to investigate the heating uniformity of raisins packed in a rectangular plastic container and treated using RF heating. The developed model was then ...

Virtual Pharmacokinetic Model of the Human Eye - new

L. Murtomäki[1], S. Kotha[2]
[1]Aalto University, Greater Helsinki, Finland
[2]University Of Helsinki, Helsinki, Finland

There is a great need for an effective drug treatment of the posterior eye, as the major reason for visual disability in industrial countries is Age-related Macular Degeneration (AMD). In USA alone, there are almost 2 million people affected by AMD [1]. A virtual pharmacokinetic 3D model of the human eye is built to address this problem, using COMSOL Multiphysics® software, based on the Finite ...

Heat and Mass Transfer in Partially Frozen Food Material

B. Watzke[1], H. Deyber[1], and H. Limbach[2]
[1]Nestlé Research Centre, Lausanne, Switzerland
[2]Research Centre, Lausanne, Switzerland

The freezing curve of the food material was extracted from Differential Scanning Calorimetry experiments. A heat conductive model was generated in COMSOL, including the thermo-physical characteristics and the phase transition behavior. The resulting temperature-time evolutions at different positions in space were in excellent agreement with our experimental data. Changing scale, the variation ...