A Galeria de Aplicações possui tutorias sobre o COMSOL Multiphysics® e aplicativos de demonstração pertinentes às áreas de elétrica, mecânica estrutural, acústica, escoamento e química. Você pode usar esses exemplos como um ponto de partida para o seu próprio trabalho de simulação baixando o modelo do tutorial ou o aplicativo e suas instruções. Use a função "Busca Rápida" para encontrar modelos da sua área de interesse. Para baixar os arquivos MPH, faça o login, ou se cadastre, no COMSOL Access usando uma licença válida do COMSOL, para poder baixar os arquivos MPH. Note que muitos dos exemplos disponibilizados aqui também podem ser acessados através da Application Libraries que faz parte do software COMSOL Multiphysics® e está disponível a partir do menu File.


Contact Switch

This model illustrates how to implement a multiphysics contact. It models the thermal and electrical behavior of two contacting parts of a switch. The electrical current and the heat flow from one part to the other only through the contact surface. The contact switch device has a cylindrical body and plate hook shapes at the contact area. There, the thermal and electrical apparent resistances ...

Steady-State 2D Axisymmetric Heat Transfer with Conduction

This model how to build and solve a conductive heat transfer problem using the Heat Transfer interface. The model, taken from a NAFEMS benchmark collection, shows an axisymmetric steady-state thermal analysis. As opposed to the NAFEMS benchmark model, we use the temperature unit kelvin instead of degrees Celsius for this model.

Thermal Stress Analysis of a Turbine Stator Blade

The conditions within gas turbines are extreme. The pressure can be as high as 40 bar, and the temperature more than 1000 K. Any new component must therefore be carefully designed to be able to withstand thermal stresses, vibrations and loads asserted by the fluid rushing through the turbine. If a component fails, the high rotational speeds can result in a complete rupture of the whole turbine. ...

Forced Convection Cooling of an Enclosure with Fan and Grille

This study simulates the thermal behavior of a computer Power Supply Unit (PSU). Most of such electronic enclosures include cooling devices to avoid electronic components to be damaged by excessively high temperatures. In this model, an extracting fan and a perforated grille cause an air flow in the enclosure to cool internal heating.

Electronic Chip Cooling

This tutorial model uses a heat sink geometry from the Part Library. The tutorial shows different approaches to heat transfer modeling when studying the cooling of an electronic chip. In the first part, only the solid parts are modeled, while the convective airflow is modeled using *Convective Heat Flux* boundary conditions. In the second part, the model is extended to include a fluid domain ...

Convection Cooking of Chicken Patties

When cooking food, such as a patty, in convection ovens there is a trade off in the heating method. If the patty is heated at a low oven temperature the cooking is slow and the patty dries out, resulting in a poor taste. If the patty is heated rapidly at a high temperature, it is difficult to get an even temperature in the patty. When the core is cooked the crust may be over-cooked. This ...

Tin Melting Front

This example demonstrates how to model phase transition by a moving boundary interface according to the Stefan problem. A square cavity containing both solid and liquid tin is submitted to a temperature difference between left and right boundaries. Fluid and solid parts are solved in separate domains sharing a moving melting front. The position of this boundary through time is calculated ...

Friction Stir Welding of an Aluminum Plate

In friction stir welding, a rotating tool moves along the weld joint and melts the aluminum through the generation of friction heat. The tool’s rotation stirs the melted aluminum such that the two plates are joined. In this model, two aluminum plates are joined by generating friction heat with a rotating tool. Heat is transferred by conduction from the tool into the plates. The movement of ...

Modeling of Material Heating via the Beer-Lambert Law

This example exemplifies how to model the Beer-Lambert law using the core functionality of COMSOL Multiphysics. A more detailed description of the phenomenon and the modeling process can be seen in the blog post "[Modeling Laser-Material Interactions with the Beer-Lambert Law](https://www.comsol.com/blogs/modeling-laser-material-interactions-with-the-beer-lambert-law/)".

Heat Transfer in a Surface-Mount Package for a Silicon Chip

All integrated circuits—especially high-speed devices—produce heat. In today’s dense electronic system layouts heat sources are many times placed close to heat-sensitive ICs. Designers of printed-circuit boards often need to consider the relative placement of heat-sensitive and heat-producing devices, so that the sensitive ones do not overheat. One type of heat-generating device is a voltage ...