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Copper Deposition in a Trench

This model demonstrates the use of moving meshes in the application of copper electrodeposition on circuit boards. In these environments, the presence of cavities or 'trenches' are apparent. The model makes use of the Tertiary, Nernst-Planck interface for electrodeposition to keep track of the deformation of the mesh. Furthermore, electrochemical reaction kinetics through use of the Butler ...

Electrodeposition of an Inductor Coil

This example models the deposition of an inductor coil in 3D. The geometry includes the extrusion of the deposition pattern into an isolating photoresist mask, and a diffusion layer on top of the photoresist. The mass transfer of copper ions in the electrolyte has a major impact on the deposition kinetics, resulting in higher deposition rates in the outer parts of the deposition pattern. The ...

Electrodeposition on a Resistive Patterned Wafer

This example models time-dependent copper deposition on a resistive wafer in a cupplater reactor. As the deposited layer builds up, the resistive losses of the deposited layer decreases. The benefit of using a current thief for a more uniform deposit is demonstrated.

Electrode Growth Next to an Insulator

This example shows how to model secondary current distribution and electrode growth with a moving geometry. To avoid numerical instabilities, a seed layer is introduced in the initial geometry to obtain a right angle at the edge between the growing electrode and the insulator.

Electrochemical Machining of a Micro Bore

For several high-precision applications, especially in hydraulic systems and fuel injectors, micro bores are needed. In most cases the shape of the injection hole, especially the edge rounding, has a significant influence on the atomization of fluids and therefore on the combustion process. Usually these micro bores are machined by electrical discharge machining (EDM). Due to the process ...

Electrodeposition of a Microconnector Bump in 2D

This model demonstrates the impact of convection and diffusion on the transport-limited electrodeposition of a copper microconnector bump (metal post). Microconnector bumps are used in various types of electronic applications for interconnecting components, for instance liquid crystal displays (LCDs) and driver chips. The location of the bumps on the electrode surface is controlled by the use ...

Cyclic Voltammetry

Cyclic voltammetry is a common analytical technique for investigating electrochemical systems. In this method, the potential difference between a working electrode and a reference electrode is swept linearly in time from a start potential to a vertex potential, and back again. The current-voltage waveform, called a voltammogram, provides information about the reactivity and mass transport ...

Superfilling Electrodeposition

This example illustrates the concept of superfilling in electrodeposition. The deposition rate is accelerated in concave areas of the surface, where the concentration of a surface catalyst is increased due to the area contraction of the moving boundary.

Copper Electroless Deposition

Electroless deposition or plating is a non-galvanic plating method that does not require any external electrical power. This technique is typically used for electroless plating of nickel, silver, gold and copper. In electroless deposition, partial oxidation and reduction reactions occur at the same electrode surface. The potential difference that exists between the equilibrium potentials for ...

Diffuse Double Layer

At the electrode-electrolyte interface, there is a thin layer of space charge in a diffuse double layer. This may be of interest when modeling devices such as electrochemical capacitors and nanoelectrodes. This tutorial example shows how to couple the Nernst-Planck equations to the Poisson equation, in order to describe diffuse double layer according to a Gouy-Chapman-Stern model. The physics ...

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