Viscoplastic Creep in Solder Joints
Application ID: 4488
This example studies viscoplastic creep in solder joints under thermal loading using the Anand viscoplasticity model, which is suitable for large, isotropic, viscoplastic deformations in combination with small elastic deformations.
The geometry includes two electronic components (chips) mounted on a circuit board by means of several solder ball joints. Significant plastic flow appears after about 40 s of thermal loading.
This model is included as an example in the following products:Nonlinear Structural Materials Module
however additional products may be needed to reproduce it. This example may be created and run using components from the following product combinations:
- COMSOL Multiphysics® and
- Nonlinear Structural Materials Module and
- either the MEMS Module, or Structural Mechanics Module
The combination of COMSOL® products required to model your application depends on several factors and may include boundary conditions, material properties, physics interfaces, and part libraries. Particular functionality may be common to several products. To determine the right combination of products for your modeling needs, review the Descrição dos Produtos and make use of a free evaluation license. The COMSOL Sales and Support teams are available for answering any questions you may have regarding this.