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Thermal Initial Stresses in a Layered Plate

Application ID: 273

The thermal stress in a layered plate is studied in this example. A plate consisting of two layers, a coating and a substrate layer is stress and strain free at 800 degrees C. The temperature of the plate is reduced to 150 degrees C and thermal stresses are induced. A third layer, the carrier layer, is added and the thermal stresses in the coating and a substrate layer are added as an initial stress and the temperature is finally reduced to 20 degrees C.

This model is included as an example in the following products:

MEMS Module Structural Mechanics Module

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