Thermal Fatigue of a Surface Mount Resistor
Application ID: 16083
A surface mount resistor is subjected to thermal cycling. The difference in the thermal expansion of different materials will introduce stresses in the structure. The solder which connects the resistor with the printed circuit board is seen as the weakest link in the assembly. It responds nonlinearly to changes in both temperature and time. In order to ensure the structural integrity of the component two fatigue analyses are performed. The first one predicts life based on the inelastic strain following a Coffin-Manson type model and the second uses the dissipated creep energy in the fatigue formulation.
This model is included as an example in the following products:Fatigue Module
however additional products may be needed to reproduce it. This example may be created and run using components from the following product combinations:
- COMSOL Multiphysics® and
- Fatigue Module and
- Nonlinear Structural Materials Module and
- Structural Mechanics Module
The combination of COMSOL® products required to model your application depends on several factors and may include boundary conditions, material properties, physics interfaces, and part libraries. Particular functionality may be common to several products. To determine the right combination of products for your modeling needs, review the Tabela de Especificações and make use of a free evaluation license. The COMSOL Sales and Support teams are available for answering any questions you may have regarding this.