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Thermal Contact Resistance Between an Electronic Package and a Heat Sink

Application ID: 14659

This example reproduces parts of the study of Ref. 1 on the thermal contact resistance at the interface between a heat sink and an electronic package. Eight cooling fins equip the cylindrical heat sink and contact is made at the radial boundaries of the package. The efficiency of the device depends on the cooling of the fins and the heat transfer from the package to the heat sink. This model focuses on the heat transfer through the contact interface where four parameters influence the joint conductance: contact pressure, microhardness of the softer material, surface roughness and surface roughness slope.

This application was built using the following:

Heat Transfer Module

The combination of COMSOL® products required to model your application depends on the physics interfaces that define it. Particular physics interfaces may be common to several products (see the Specification Chart for more details). To determine the right combination of products for your project, you should evaluate all of your needs in light of each product's capabilities, consultation with the COMSOL Sales and Support teams, and the use of an evaluation license.