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Parameterized Electronic Enclosure Geometry

Application ID: 6222

This study simulates the thermal behavior of a computer Power Supply Unit (PSU). Most of such electronic enclosures include cooling devices to avoid electronic components to be damaged by excessively high temperatures. In this model, an extracting fan and a perforated grille cause an air flow in the enclosure to cool internal heating.

This model is included as an example in the following products:

Heat Transfer Module

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