Artigos Técnicos e Apresentações

Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

Simulation of PTFE Billet Sintering using COMSOL

A. Roday, and P. Nicosia
Garlock Sealing Technologies
Palmyra, NY

Sintering is an important step in the manufacturing of polytetrafluoroethylene (PTFE) billets. The challenge in heating large billets stems from the inherent low thermal conductivity of PTFE. Existing literature suggests determining maximum heating rate experimentally using recommended guidelines. This paper uses COMSOL to aid in optimizing the temperature profile required for a particular ...

Coupled Magnetodynamic and Electric Circuit Models for Superconducting Fault Current Limiter

L. Graber[1], J. Kvitkovic[1], T. Chiocchio[1], M. Steurer[1], S. Pamidi[1], and A. Usoskin[2]
[1]Center for Advanced Power Systems, Florida State University, Tallahassee, FL
[2]Bruker Energy & Supercon Technologies Inc., Billerica, MA

Finite element models, which include the shielding characteristics of superconductors are often complex and would currently not allow us to study 3D models of devices of complex geometry such as fault current limiters. We propose instead a model based on variable electric conductivity, which is suitable to simulate magnetic field characteristics of inductive superconducting fault current ...

Simulation Studies on Stress Generation and Volume Expansion due to Electrochemical Lithium Insertion in a Silicon Nanowire

G. Sikha, and J. Gordon
Applied Materials, Inc.
Santa Clara, CA

Silicon electrodes are presently being pursued as the potential negative electrode for lithium-ion batteries owing to its high gravimetric (mAh/g) and volumetric capacity (mAh/L) compared to the existing state of the art graphite electrode. Recent experimental studies have demonstrated the use of nano size Si electrodes which minimizes insertion induced stresses due to facile strain ...

Simulation of Quench Propagation in a Double-Helix Superconducting Magnet with COMSOL Multiphysics

P. Masson
Advanced Magnet Lab
Palm Bay, FL

The paper presents the numerical analysis of quench propagation in a DH magnet wound with a commercially available MgB2 wire in a fiber-glass composite matrix and operating at 20 K. The quench is induced by a small heater located on the first layer of the magnet close to the peak field area. The quench dynamics, peak temperature along with detection requirements are derived from the simulation ...

Modeling Linear Viscoelasticity in Glassy Polymers using Standard Rheological Models

M. Haghighi-Yazdi, and P. Lee-Sullivan
University of Waterloo
Waterloo, ON
Canada

In this study, a capability has been developed for modeling the linear viscoelastic behaviour of a glassy polymer using COMSOL Multiphysics®. The two rheological models by Maxwell and Kelvin-Voigt were used for modeling stress relaxation and creep loading behavior, respectively, of a typical gas pipe under two modes of plane stress and plane strain. An advantage of the developed model is its ...

Microwave Drying of Cellular Ceramic Substrates: A Conjugate Modeling Approach to Understand Surface Moisture Migration

A. Halder, and J. George
Corning, Inc.
Painted Post, NY

Microwave drying processes are critical components in the manufacture of cellular ceramic substrates and filters. The objective of this study is to develop a comprehensive model at a small scale and include all the possible physics that are important during microwave drying processes. Based on the results, conclusions are made on the importance of different factors in drying.

Optimization of a High-Temperature High-Pressure Direct Wafer Bonding Process for III-V Semiconductors

R. Martin, J. Kozak, K. Anglin, and W. Goodhue
University of Massachusetts Lowell
Lowell, MA

Many optoelectronic devices utilize a heterojunction of a pair semiconducting materials including high-efficiency MEMS devices, solar cells, LEDs, and VCSELs. One fabrication technique which achieves such a device is direct wafer fusion. To optimize the process, COMSOL Multiphysics 4.0 was used to test various geometric configurations of the fixture. 2D and 3D models were created in order ...

An Analysis of Spin-Diffusion Dominated Ferrofluid Spin-Up Flows in Uniform Rotating Magnetic Fields

S. Khushrushahi[1], A. Guerrero[2], C. Rinaldi[3], and M. Zahn[1]
[1]Massachusetts Institute of Technology, Cambridge, MA
[2]Univeridad Industrial de Santander, Bucaramanga, Colombia
[3]University of Puerto Rico, Mayaguez, Mayaguez, PR

This work analyzes the spin-diffusion dominated explanation for spin-up bulk flows in ferrofluid filled cylinders, with no free surface, subjected to a uniform rotating magnetic field. COMSOL results are compared to experimental results and analytical results. Simulating ferrofluid spin-up flows have many subtleties, especially when using a single domain region to model the ferrofluid cylinder ...

Study of AC Electrothermal Phenomena Models

S. Loire, and P. Kauffmann
University of California
Santa Barbara, CA

Recently, electrokinetic flows have raised the interest of the scientific community. Driving flow with an electric field leads to promising applications for mixing, concentration, pumping application in lab on chips. However, current models are still inaccurate and don\'t fit the measures. The simple decoupled model developed by Ramos et al does not predict velocities for all parameters. ...

Modeling and Simulation of Artificial Core-Shell Based Nanodielectrics for Electrostatic Capacitors Applications

D. Musuwathi Ekanath[1], N. Badi[1], and A. Bensaoula[2]
[1]Center for Advanced Materials, University of Houston, Houston, TX
[2]Dept. of Physics, University of Houston, Houston, TX

The need for high storage capacitors led to the development of polymer based capacitors. Polymers have high processability, mechanical flexibility, electrical breakdown strength and compatibility with printed circuit board (PCB) technologies; but usually have very low permittivity (K). In COMSOL Multiphysics software, the AC/DC module is selected and the In-plane electric currents are applied ...

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